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Industry Case Studies Program 2017 – Industry Day (ICSP 2017)


Industry Applications and Standard initiatives for Cooperative Information Systems

The future for the Cyber Physical Systems

October, 24th, 2017, Rhodes, Greece

 

Supported by
Object management Group (OMG) (http://www.omg.org)
Industrial Internet Consortium (http://www.iiconsortium.org)
IFAC TC 5.3 on “Enterprise Integration and Networking” (http://www.ifac-tc53.org)

IFAC TC 9.3 on “Control for Smart cities” (https://tc.ifac-control.org/9/3)
SIG INTEROP Grande-Région on “Enterprise Systems Interoperability” (http://www.interop-grande-region.eu)

 

 

sb omg   IIC Logo interop GB 

 

 

Call for Contributions

 

Cooperative Information Systems provide enterprises and communities of users with flexible, scalable and intelligent services in large-scale networking environments. The OTM conference series has established itself as a major international forum for exchanging ideas and results on scientific research for practitioners in fields such as computer supported cooperative work (CSCW), middleware, Internet/Web data management, electronic commerce, workflow management, knowledge flow, agent technologies and software architectures, to name a few.


The recent popularity and interest in service-oriented architectures & domains require capabilities for on-demand composition of services. Furthermore, cloud computing environments are becoming more prevalent, in which information technology resources must be configured to meet user-driven needs. These emerging technologies represent a significant need for highly interoperable systems. This edition will address a particular set of topics and applications related to Interoperability for Cyber Physical Systems.


As a part of OnTheMove 2017, we are organizing an Industry Case Studies Program in order to emphasize the Research/Industry cooperation on these future trends. The focus of the program will be a discussion of ideas where research areas address interoperable information systems and infrastructure. Industry leaders, standardisation initiatives, European and international projects consortiums are invited to submit 4-6 pages position papers discussing how projects within their organizations address software, systems and architecture interoperability.

 


IMPORTANT DATES


    Short Paper Submission Deadline        July 31st, 2017
    Acceptance Notification        August 20th, 2017
    Camera Ready Due        September 1st , 2017
    Registration Due        September 1st , 2017
    OTM Conferences        October 24 - 38, 2017

 

 

SPONSORSHIP PACKAGES

 

SPONSORSHIP PACKAGES ARE AVAILABLE TO PROMOTE YOUR COMPANY, YOUR PRODUCTS, OR YOUR BUSINESS. PLEASE CONTACT US FOR MORE INFORMATION.

 

YOU CAN ALSO HAVE A LOOK AT: http://otmconferences.org/index.php/homepage/sponsorship-opportunities

 

 

SUBMISSION GUIDELINES


Each submitted paper will be refereed by at least three members of the Program Committee, based on its originality, significance, technical soundness, and clarity of expression. Submissions must be in English, and may discuss industrial experience or academic research should not exceed 4 pages in the final camera-ready format. Only electronic submissions in Adobe PDF format are acceptable.


The final workshop proceedings will be published by Springer Verlag as LNCS (Lecture Notes in Computer Science). Author instructions can be found at:
http://www.springer.de/comp/lncs/authors.html


All authors will also participate in a panel that will occur at the end of the session.

 

For more information, please send a short abstract to the Program Chair.

 

Prof. Hervé Panetto, PhD
University of Lorraine, France
E-mail: This email address is being protected from spambots. You need JavaScript enabled to view it.  

 

 

PROGRAM COMMITTEE (TO BE CONFIRMED AND COMPLETED)

 

The program committee is composed of representatives of industry, standard initiatives and European or international R&D projects

 

Industry


Michael Alexander, IBM, Austria
Sinuhe Arroyo, Taiger USA
Ian Bayley, Model Futures, UK
Gash Bhullar, Control 2K, UK
Serge Boverie, Contiental Engineering Services, France
Christoph Bussler, Oracle Corporation, USA
Ben Calloni, Lockheed Martin, USA
David Cohen, Microsoft, France
Eva Coscia, Holonix, Italy
Tuan Dang, EDF Research, France
Francesco Danza, Digital Video, Italy
Piero De Sabbata, ENEA, Italy
Michael Ditze, TWT Gmbh, Germany
Jacques Durand, Futjisu, USA
Dominique Ernadote, EADS-Cassidian
Kurt Fessl, Industrie Informatik GmbH, Austria
Nicolas Figay, Airbus Group Innovations, France
Fabrizio Gagliardi, Microsoft, Switzerland
Jean-Luc Garnier, Thales Group, France
Pascal Gendre, Airbus, France
Ted Goranson, Sirius Beta, USA
Mattew Hause, ATEGO, USA
Mathias Kohler, SAP, Germany
Antoine Lonjon, MEGA, France
Gottfried Luef, IBM, Austria
Juan-Carlos Mendez, AdN International, Mexico
Silvana Muscella, Trust - IT Services, UK
Yannick Naudet, LIST, Luxemburg
Christoph Niedermeier, Siemens, Germany
Ed Parsons, Google, UK
Andrea Persidis, Biovista, Greece
Daniel Sáez Domingo, ITI, Spain
Joe Salvo, GE, USA
Ayelet Sapir, Pangea, Israel
Stan Schneider, RTI, USA
Mark Schulte, Boeing, USA
Dirk Slama, Bosch, Germany
Georg Weichhart, Profactor GmbH, Austria
Detlef Zühlke, DFKI, Germany

 

 

Standards


Peter Benson, ECCMA
Marc Delbaere, SWIFT, Belgium
Sheron Koshy, ECCMA India
Richard Martin, ISO TC184/SC5
Richard Soley, OMG and IIC, USA
Maximiliano Vargas, ASAM Brazil
Martin Zelm, INTEROP Vlab

 

 

Academics


Vasco Amaral, New University of Lisbon, Portugal
Luis Camarinha-Matos, Uninova, Portugal
Vincent Chapurlat, EMA, France
Michele Dassisti, Politecnico di Bari, Italy
Giuseppe Di Fatta, University of Reading, UK
Giancarlo Fortino, University of Calabria, Italy
Andres Garcia Higuera, University Castilla-La Mancha, Spain
Ricardo Goncalves, New University of Lisbon, UNINOVA, Portugal
Peter Gorm Larsen, Aarhus University, Denmark
Qing-Shan Jia, Tsinghua University, P.R. China
Wenchao Li, Boston University, USA
Peter Loos, IWi at DFKI, Saarland University
Eduardo Loures, PUC-PR, Brazil
Arturo Molina, Tecnologico de Monterrey, Mexico
Yasuyuki Nishioka, Hosei University, Japan
Sergio F. Ochoa, University of Chile, Chile
Hervé Panetto, University of Lorraine, France
Sobah Abbas Pertersen, SINTEF, Norway
Jean Simao, UTFPR, Brazil
Hans Vandheluwe, University of Antwerpen, Belgium
Dimitri Varoutas, University of Athens, Greece
François B. Vernadat, Université de Lorraine, France
Paulo Whitman, UTFPR, Brazil
Lawrence Whitman, University of Arkansas at LR, USA
Milan Zdravkovic, University of Nis, Serbia